Failure Analysis:
The Specialty Lab, Inc.
 
Radiography
Real Time X-Ray
Fine and Gross Leak (Hermeticity)
Internal Visual
Microsectioning
Die Shear
SEM Metallization
Jet-Etch
Destructive Physical Analysis (DPA)
Baseline Analysis
Sonoscan
Board Contamination
Two-point Microprobing
Auger Microanalysis
Dynamic Voltage Contrast
Digital Imaging
Electron Spectroscopy for Chemical Analysis (ESCA)
Fourier Transform Infrared Spectroscopy (FTIR)
IR Microscopy
Reverse Engineering
Secondary Ion Mass Spectroscopy (SIMS)
Differential Scanning Calorimetry (DSC)
Analysis of Mechanical Components
Analysis Electronic Components
Die Probing
Electrical Testing per Specification
Decapsulation to Reveal Internal Construction and Defects
Microsectioning
Optical and Scanning Electron Microscopy
Removal of Semiconductor Die Passivation, Metallization, Oxide and Polysilicon Layers
Thermal Imaging
Electronics Testing
Environmental Testing
Package, Shipping Testing
Vibration and Shock Testing
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Failure Analysis
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