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Printed Circuit boards, Electronic sub-assemblies, microelectronics ; DPA (destructive physical analysis). Our experience allows us to maintain turn-around time of a few days to help you solve problems quickly. |
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Surface Dendrite Growth Metallic crystal growth from one electrical potential to another is caused by surface contamination on a printed circuit board. The example to the left became visible at medium power under specific lighting conditions. |
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- Analysis of mechanical & electronic components
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- Die passivation, metallization, oxide, and polysilicon layers
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- Optical & Scanning Electron Microscope
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- Decapsulation to reveal internal construction/defects
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- Electrical testing per specification
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- Bond strength (Wire pull)
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- Internal water vapor content (Residual gas analysis)
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- Energy Dispersive X-Ray Analysis (EDX)
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- Lead integrity & tensile strength
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- Fine & gross leak (Hermeticity)
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Dull Drill Bit A dull drill bit during fabrication has pressed some excess material onto the ground plane. This material was then plated over, causing a faulty plated thru hole. |
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Dull Drill Bit A dull drill bit during fabrication has caused delamination. The cavity was consequently filled with a contaminant. After plating, when the board was heated, the contaminant outgassed, causing the plating to fracture and produce an open thru hole. |
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Plating error This board was immersed for too short a period of time in the plating process. The result is an open from the top to bottom. |
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