Site Map

Home

Testing

Failure Analysis

Contact
 

Test Services

Electronic:
  • Screening/rescreening
  • Qualification
  • Design conformance
  • Point of failure
  • Specification verification
  • Production testing
  • Failure mode simulation
  • Parameter sorts
  • Temperature characterization
  • Life testing
  • ESD susceptibility
  • PCB impedance
  • ESD protective material testing
  • Curve trace
  • Transient susceptibility
  • Test currents (pA - kA)
  • Latch-up
  • Thermal impedance
  • Test voltages (pV - kV)
  • High frequency to 18GHz
  • Hi-pot (AC or DC)/Dielectric withstanding/Insulation resistance
  • Particle Impact Noise Detection (PIND)

ESD Damage

A “punch”, or vertical short, .67 microns in diameter

Another punch, this one 5 microns in diameter

An emitter-base (horizontal) short, 2 microns in length

Environmental testing:

Product package testing:
  • Mechanical shock
  • Vibration
  • Burn-in temperature
  • Humidity
  • Temperature cycling
  • Thermal shock
  • Salt atmosphere
  • Constant acceleration
  • Highly Accelerated Stress Test (HAST)
  • Tensile/compression testing
  • Vibration testing
  • Shock testing
  • Compression testing
  • Transportation Simulation
  • Package Testing

Vibration Damage

Cracked EPROM window

Part loosened from board

Test Specifications:

Consulting:
  • Design analysis
  • Test equipment design
  • ESD auditing and training
  • MTBF reports based on MIL-HDBK-217 and BELLCORE(Telcordia)
 
  • Mil-Std 202,750,883,19500
  • UL
  • ANSI/IEC
  • JEDEC
  • IEC
  • IPC
  • ASTM
  • ISTA
  • Commercial
  • Automotive
  • Custom