Failure Analysis:
The Specialty Lab, Inc.
Radiography
Fine and Gross Leak (Hermeticity)
Internal Visual
Microsectioning
Die/Ball Shear
SEM Metallization
Destructive Physical Analysis (DPA)
Baseline Analysis
Sonoscan
Board Contamination
Two-point Microprobing
Digital Microscopy
Fourier Transform Infrared Spectroscopy (FTIR)
IR Microscopy
Analysis of Mechanical Components
Analysis Electronic Components
Electrical Testing per Specification
Decapsulation to Reveal Internal Construction and Defects
Microsectioning
Optical and Scanning Electron Microscopy
Removal of Semiconductor Die Passivation, Metallization, Oxide and Polysilicon Layers
Thermal Imaging
Electronics Testing
Environmental Testing
Package, Shipping Testing
Vibration and Shock Testing
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Failure Analysis
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